Elastifile to Present the Benefits of Cloud-Integrated Semiconductor Design At D&R IP-SoC Days

SANTA CLARA, Calif.March 29, 2018 — Elastifile, the enterprise hybrid cloud data management company, announced today that it is presenting at the Design & Reuse IP-SoC Days event at the Hyatt Regency in Santa Clara, Calif. April 5 at 2 p.m.

Entitled “Cloud-Integrated IP Design: Bursting EDA Workflows to the Public Cloud,” the presentation by Elastifile’s Director of Marketing, Jerome McFarland, will explain how Elastifile’s solution enables semiconductor design firms to efficiently burst EDA workflows, tools, and scripts to the public cloud, with no application refactoring required.

“As IC complexity and time-to-market pressure increases, the benefits of cloud-integrated semiconductor design have become increasingly apparent,” said McFarland. “We look forward to sharing our insights regarding practical, cost-effective strategies for achieving scalable, hybrid cloud EDA infrastructure.”

Part of the D&R IP-SoC series, the Santa Clara event provides the worldwide community of 27,000 active members with the latest vision of the trends in IP-based electronic systems, as well as information about the most-advanced offerings from the best specialists in the field ranging from foundries, EDA vendors, IP providers, design houses to electronic system companies. For more information, or to register for the event, interested parties can visit http://www.design-reuse-embedded.com/ipsocdays/ipsocdays2018/santaClara2018/

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