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DAC 2018, eSilicon, and Bursting EDA to the Cloud

Today is the first day of the 55th Design Automation Conference (DAC), one of the leading events in the semiconductor design and manufacturing industry. As discussed in a previous blog, the semiconductor industry is primed to embrace the public cloud to leverage the corresponding scale and elasticity benefits. As evidence of this, we are pleased to announce that eSilicon Corporation, an independent provider of FinFET-class ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, has chosen the Elastifile Cloud File System to support its cloud integration initiatives. To learn more about this exciting collaboration, check out this brief video and the corresponding press release.

Also, if you happen to be onsite at DAC today, we hope you’ll join us for an industry networking event, organized by HPC Pros, on Monday night from 7pm-10pm at the ThirstyBear Organic Brewery on June 25. If you’re interested in attending the event, drop us an email at info@elastifile.com.

Topics: Manufacturing,